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International Journal of

Recent Trends in Engineering

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International Journal of Recent Trends in Engineering (IJRTE)

ISSN 1797-9617

Volume 1,  Number 4,  May 2009

Issue on Electrical & Electronics

Page(s): 79-81

FEM Simulation of Novel Thermal Microactuator

           B.G.Sheeparamatti, J.S.Kadadevarmath, and M.S. Hebbal

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Microcantilevers are the basic and fundamental MEMS based structures used in microsystems. Microcantilevers have been used both as sensors and actuators. In this paper, modeling and simulation details of a microcantilever for thermal actuation are presented. The advantage of this actuator is, the tip of this actuator which actually drives some other object doesn’t gets heated and hence can be used in any environment safely. The main objective of this work is to investigate the nature of deflection of microcantilever based actuator for the applied potential difference across the base pads. In this device, two microcantilevers of different dimensions are considered and when these are subjected to same current, deflect differently. The current density in the thin arm is greater than the current density in the thick arm. Therefore, the thin arm heats up more than the thick arm, which makes the thin arm to bend. Thus, temperature produces thermal strain and thermally induced deflections. This turns the microstructure into a thermal actuator. The amount of tip deflection is a direct function of the applied potential difference between the electrical connection pads. Therefore, the amount of tip deflection can be calibrated as a function of applied voltage. Additional objectives of this work are to obtain voltage, temperature and displacement plots. Increasing the applied voltage in the model developed in ANSYS/Multiphysics, resulted in increase in the deflection. This is because of direct relationship between the applied voltage, current density, temperature developed and deflection.

Index Terms

Microcantilever, thermal microactuator, FEM Analysis, ANSYS/ Multiphysics, MEMS

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